Solution
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PSE background suppression sensors can be installed below the conveyor belt to detect the passage of wafers. Conventional diffuse reflection sensors cannot reliably detect wafers due to differences in color and reflectivity. The unique optical design structure of PSE background suppression sensors allows the product to be unaffected by fluorescent lamps and external ambient light, enabling stable and reliable detection.
Convergent reflective series with a focal point center at 10mm. It can stably detect small objects or notches on chips at the focal point.
The CCD linear diameter measuring sensor performs projection measurement on the edge of the wafer. By detecting and measuring the target width and position, the integrity of the wafer edge can be determined.
3D line scanner can quickly and accurately scan the adhesive information of chips. Through algorithm processing, the area and thickness of the adhesive can be directly calculated.
Chip Position Confirmation Detection
By using PDA-CR series sensors to measure BGA and PGA series chips, dimensional information such as ball height, ball diameter, and ball position can be obtained. At the same time, the height and positional accuracy of PGA pins can be accurately detected.
Spectral confocal sensors have stable measurement performance for highly reflective materials and can achieve sub-micron level measurement accuracy. Therefore, it is very suitable for the measurement of wafer chip height.
