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Lead Frame Inspection

The through beam front-emitting series, designed with a red light source, is used to detect irregular stacking of lead frames.


PCB Stack Height Detection

Through beam type photoelectric sensors achieve short-distance, high-precision monitoring of PCB stack height, while laser displacement sensors accurately measure the height of PCB components, enabling precise identification of ultra-high components.


Workpiece in Place Detection

The background suppression series sensors, with its laser-like spot and excellent black-white sensitivity, can stably detect the presence of components.


Lead Frame Error Detection

The through-beam positive-emitting series, designed with a red light source, is used to detect irregular stacking of lead frames.


Chip Presence Detection

With the small spot size of the PDA-CR product, it can accurately detect these tiny objects such as chips, thereby determining their presence or absence.


Substrate Warping Detection

By using the PDA-CR product to measure the height of multiple surfaces of the PCB substrate, the uniformity of the height values can be used to determine whether there is substrate warping.


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